View The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates 2nd Edition by Ventec International Group

The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates 2nd Edition

by Ventec International Group

Softcover
Flexible, high-gloss laminated cover
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About the Book
Considering thermal issues in the earliest stages of the design process is critical. Written by Didier Mauve, sales and marketing manager at Ventec International Group, and Ian Mayoh, technical support manager, this book highlights the need to dissipate heat from electronic devices.
Features & Details
  • Primary Category: Reference
  • Project Option: 6×9 in, 15×23 cm
    # of Pages: 68
  • Isbn
    • Softcover: 9780999864838
  • Publish Date: Mar 22, 2018
  • Language English
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About the Creator
I-007eBooks
IPC Publishing Group, Inc.
Bannockburn, IL

IPC Publishing Group, Inc. dba I-Connect007, is dedicated to educating and informing the electronics interconnect supply chain community with content worth sharing. I-007eBooks was launched in 2017 with a micro eBook "guide to" series. I-007eBooks.com is the library for our main site, I-Connect007.com.

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